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Semiconductor Equipment Corp 3250 Wafer Backlap Applicator Tag #53
$ 3432
- Description
- Size Guide
Description
Semiconductor Equipment Corp 3250 Wafer Backlap ApplicatorInventory No. 63000
Semiconductor Equipment Corp 3250 Wafer Backlap Applicator.
Semiconductor Equipment Corporation´s Model 3250 applies Protective Tape to Your Wafer Prior to Backlapping. The applicator also:
Eliminates bubbles between tape and wafer
Provides uniform tension between tape and wafer
Operates with backed and non-backed tape
Provides adjustable roller pressure
Cuts tape within .005 ” of edge of wafer
FEATURES
Four, five, six and eight inch wafer capability standard.
Trims tape to the edge of the wafer including the flats, within .005 “.
Manual tape feed.
Manual tape tensioner.
Compatible with standard or interleaved tape.
Vacuum stage wafer hold-down.
Built in cutter tape separation systems.
Captive roller assembly assures consistent wafer/film frame contact pressure.
Adjustable spring loaded platen for optimum contact pressure.
Includes the optional Items:
Heated Blade Assembly. Heats cutting blade to reduce friction when cutting particular types of back lapping tapes. Heats to 75 degrees C.
Motorized Take-up System to gather the liner from dicing tape onto a disposable core. Many semiconductor dicing tapes have a protective liner, which has to be gathered and disposed of. This option makes that process effortless and convenient.
115V, 50/60Hz, 2A
Please contact us for additional information on this system, including lead-time, or for any questions via eBay mail.
BID SERVICE has been meeting the equipment needs of the Semiconductor and Scientific communities for the past 30 years. Our expert refurbishing services, demonstration capabilities, and broad selection of inventory add up to value for our customers.
*****International Buyers - Please Note:
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